RESEARCHER PROFILE
Shaikh Reaz Ahmed
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Bangladesh University of Engineering and Technology
Shaikh Reaz Ahmed works in Non-Destructive Testing Techniques, Ultrasonics and Acoustic Wave Propagation, Metallurgy and Material Science, Fatigue and fracture mechanics, Electrodeposition and Electroless Coatings. Recorded institutional associations include Bangladesh University of Engineering and Technology.
78Publications
708Citations
14H-index
Inclusion identifies researchers whose recorded research contributions may inform their university’s understanding of its research community. It does not rank individual research quality or establish current employment.
Selected research works
Up to 100 highly cited works; DOI links open the original research. Counts reflect the collected record, not real-time citation totals.
Self-Assembly of Vertically Aligned Nanorod Supercrystals Using Highly Oriented Pyrolytic Graphite
2007 · 112 citationsStrain-rate dependency and impact dynamics of closed-cell aluminium foams
2021 · 63 citationsCentimetre scale assembly of vertically aligned and close packed semiconductor nanorods from solution
2009 · 58 citationsThe Next Frontier: Electrodeposition for Solar Cell Fabrication
2011 · 54 citationsPackaging technology for IBM's latest mainframe computers (S/390/ES9000)
2002 · 40 citationsGold tip formation on perpendicularly aligned semiconductor nanorod assemblies
2008 · 39 citationsImpurities in the Electroplated sub-50 nm Cu Lines: The Effects of the Plating Additives
2014 · 30 citationsA new ultrasonic angle-beam technique for sensitive evaluation of closed cracks
2000 · 23 citationsNanometre-scale optical property fluctuations in Cu2ZnSnS4 revealed by low temperature cathodoluminescence
2017 · 23 citationsHeat conduction in a symmetric body subjected to a current flow of symmetric input and output
2008 · 20 citationsA Sensitive Ultrasonic Approach to NDE of Tightly Closed Small Cracks
1998 · 19 citationsReal Time Observation by Atomic Force Microscopy of Spontaneous Recrystallization at Room Temperature in Electrodeposited Copper Metallization
2003 · 16 citationsClose‐Packed Gold‐Nanocrystal Assemblies Deposited with Complete Selectivity into Lithographic Trenches
2008 · 16 citationsInvestigation of stress and morphology in electrodeposited copper nanofilms by cantilever beam method and in situ electrochemical atomic force microscopy
2008 · 15 citationsA Model for Spontaneous Morphology Change in Electrodeposited Metal Films during Room-Temperature Aging
2006 · 13 citationsNumerical solution of mixed boundary-value elastic problems
1993 · 13 citationsVacancy-Induced Plastic Deformation in Electrodeposited Copper Films
2007 · 11 citationsOn the investigation of reuse potential of SnPb-solder affected copper subjected to work-hardening and thermal ageing
2021 · 11 citationsThermomechanical modeling of dissimilar-material interfaces in composite structures
2023 · 10 citationsOverview of packaging for the IBM Enterprise System/9000 based on the glass-ceramic copper/thin film thermal conduction module
1992 · 9 citationsQuantitative nondestructive testing of small, tight cracks using ultrasonic angle beam technique
2000 · 9 citationsInfluence of Wall Thickness on the Ultrasonic Evaluation of Small Closed Surface Cracks and Quantitative NDE
2002 · 8 citationsEnhancing Repeatability in the Measurement of Potential Drop using an Adjustable Four-Point-Probe Measuring System
2007 · 8 citationsAn Isothermal Annealing Study of Spontaneous Morphology Change in Electrodeposited Copper Metallization
2007 · 7 citationsSelecting Suitable Probes Distances for Sizing Deep Surface Cracks Using the DCPD Technique
2006 · 6 citations
