RESEARCHER PROFILE

Thomas Licht

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Hochschule Düsseldorf University of Applied Sciences

Electronic Packaging and Soldering TechnologiesSilicon Carbide Semiconductor TechnologiesFatigue and fracture mechanicsAdvanced Welding Techniques AnalysisWelding Techniques and Residual Stresses

Thomas Licht works in Electronic Packaging and Soldering Technologies, Silicon Carbide Semiconductor Technologies, Fatigue and fracture mechanics, Advanced Welding Techniques Analysis, Welding Techniques and Residual Stresses. Recorded institutional associations include Hochschule Düsseldorf University of Applied Sciences.

26Publications
928Citations
12H-index

Inclusion identifies researchers whose recorded research contributions may inform their university’s understanding of its research community. It does not rank individual research quality or establish current employment.

Selected research works

Up to 100 highly cited works; DOI links open the original research. Counts reflect the collected record, not real-time citation totals.

  1. Model for Power Cycling lifetime of IGBT Modules - various factors influencing lifetime

    2008 · 470 citations

  2. Power cycling induced failure mechanisms in solder layers

    2007 · 116 citations

  3. Power cycling induced failure mechanisms in the viewpoint of rough temperature environment

    2008 · 56 citations

  4. IGBT module technology with high partial discharge resistance

    2002 · 50 citations

  5. Accelerated mechanical fatigue testing and lifetime of interconnects in microelectronics

    2010 · 49 citations

  6. High temperature reliability on automotive power modules verified by power cycling tests up to 150°C

    2003 · 39 citations

  7. Reliability testing of high-power multi-chip IGBT modules

    2000 · 30 citations

  8. A fast mechanical test technique for life time estimation of micro-joints

    2008 · 23 citations

  9. Properties of solders and their fatigue in power modules

    2002 · 18 citations

  10. Solder Fatigue at High-Power IGBT Modules

    2006 · 18 citations

  11. Reliable power electronics for automotive applications

    2002 · 16 citations

  12. AlSiC composite materials in IGBT power modules

    2002 · 13 citations

  13. A solder bumping interconnect technology for high-power devices

    2004 · 12 citations

  14. System design of compact low-power inverters for the application in photovoltaic AC-modules

    2008 · 5 citations

  15. Micro-additives and their impact on tensile and fracture performance of solder

    2023 · 5 citations

  16. Life-Cycle Assessment for Power Electronics Module Manufacturing

    2019 · 2 citations

  17. Throughput Optimization of a Sintering Die Attach Process

    2021 · 2 citations

  18. A new method to characterize the thermomechanical response of multilayered structures in power electronics

    2006 · 1 citations

  19. A fast test technique for life time estimation of ultrasonically welded Cu–Cu interconnects

    2010 · 1 citations

  20. Influence of Micro-Additives on Lead-Free Solder Joints

    2021 · 1 citations

  21. On the Influence of Nickel Deposition Techniques on Solder Joint Phase Formation

    2021 · 1 citations

  22. Experimentelle Untersuchungen zum zeitlichen Spannungsverlauf in dünnwandigen Stahlsilos

    2000 · 0 citations

  23. Comparison of Electroplated Ni and PVD Ni Coating Layers after Soft Soldering Process

    2019 · 0 citations

  24. On-Chip Diffusion Bonding creates Stable Interconnections Usable at Temperatures over 300°C

    2019 · 0 citations

  25. TLPB Improves Solder Connections by On Chip Creation of Intermetallic Phase Precursors

    2019 · 0 citations

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